Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Miho Hirai0
Date of Patent
April 14, 2009
0Patent Application Number
109954670
Date Filed
November 24, 2004
0Patent Primary Examiner
Patent abstract
A semiconductor device has a bonding pad configured to be bonded to a bonding member, a test pad configured to contact with a test probe at a test, and an internal circuit electrically connected to the bonding pad and the test pad. The bonding pad overlaps with the internal circuit in a direction vertical to a surface of a semiconductor chip. The test pad does not overlap with the internal circuit in the direction.
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