Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 14, 2009
0Patent Application Number
114623020
Date Filed
August 3, 2006
0Patent Primary Examiner
Patent abstract
The present invention is an inductive element formed by a printed circuit board (PCB), which includes holes in the insulating layers that are filled with non-conductive material having high magnetic permeability, to reduce the magnetic reluctance of a magnetic path of the inductive element. Some embodiments of the present invention may use non-conductive materials having high magnetic permeability to connect the filled holes, such that a contiguous magnetic path is formed, which significantly reduces the reluctance of the contiguous magnetic path. Reducing the reluctance increases the inductance of the inductive element.
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