Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
SeungYun Ahn0
Koo Hong Lee0
SeongMin Lee0
Date of Patent
April 21, 2009
0Patent Application Number
112769480
Date Filed
March 17, 2006
0Patent Primary Examiner
Patent abstract
A multichip package system is provided forming a substrate having a plurality of molding transfer channel, connecting a first integrated circuit die on a top side of the substrate, connecting a second integrated circuit die on a bottom side of the substrate, and concurrently encapsulating the first integrated circuit die and the second integrated circuit die with a molding compound flow through the plurality of the molding transfer channels.
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