US Patent 7521338 Method for sawing semiconductor wafer
Patent 7521338 was granted and assigned to Texas Instruments on April, 2009 by the United States Patent and Trademark Office.
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Patent abstract
Semiconductor wafer sawing systems and methods are described in which a wafer may be secured in a sawing position having a surface exposed to incur sawing with at least a portion of the exposed wafer surface positioned below the center of gravity of the wafer such that prevailing force of gravity may be used to assist in the removal of contaminants from the wafer.
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US Patent 07521338 Method for sawing semiconductor wafer US Patent 7521338 Method for sawing semiconductor wafer
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Patent Number
0752133800
Patent Number
752133800
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075213380
Date of Patent
April 21, 2009
0Patent Application Number
116152600
Date Filed
December 22, 2006
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075213380
Date of Patent
April 21, 2009
0Patent Application Number
116152600
Date Filed
December 22, 2006
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
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Website URL
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US Patent 07521338 Method for sawing semiconductor wafer
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07521338
Date of patent
April 21, 2009
Patent application number
11615260
Date Filed
December 22, 2006
Patent primary examiner
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