Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Motoi Nezu0
Daisuke Akita0
Masaki Kanazawa0
Minoru Ametani0
Date of Patent
April 21, 2009
0Patent Application Number
115441890
Date Filed
October 5, 2006
0Patent Primary Examiner
Patent abstract
A method and an apparatus for peeling a surface protective film attached on the surface of a semiconductor wafer are provided. A heating block is set in proximity to the whole surface of the semiconductor wafer, and the whole surface protective film is heated by the heating block. Thus, the air bubbles existing between the semiconductor wafer and the surface protective film are expanded or swelled, and the adhesion between the semiconductor wafer and the surface protective film is weakened. After that, the surface protective film is peeled from the semiconductor wafer. As a result, a peel starting point can be appropriately formed and damage to the wafer can be prevented.
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