Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Taeho Kim0
Tae Keun Lee0
Date of Patent
April 21, 2009
Patent Application Number
11354694
Date Filed
February 14, 2006
Patent Primary Examiner
Patent abstract
An integrated circuit package system is provided providing an integrated circuit die, and enclosing the integrated circuit die in a heat dissipation enclosure comprises mounting the integrated circuit die on a die paddle attaching a heat block ring to the die paddle around the integrated circuit die, and attaching a heat slug on the heat block ring over the integrated circuit die.
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