Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chris Dunn0
Christopher Schreiber0
Date of Patent
April 28, 2009
0Patent Application Number
111252810
Date Filed
May 9, 2005
0Patent Primary Examiner
Patent abstract
A method of fabricating a flexible circuit interconnect comprising a conductive pattern on a flexible substrate comprising layers of different components having different coefficients of thermal expansion, including exposing the flexible substrate sequentially to different temperature regimes tending to differentially expand the flexible circuit components, dimensionally stabilizing the flexible substrate with an added stainless steel layer only during said exposing to different temperature regimes, and removing stainless steel of the added layer from the flexible circuit after exposing the flexible circuit.
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