Patent attributes
A semiconductor device includes: an insulating layer selectively formed on the semiconductor base material; a first semiconductor layer made of single-crystal and formed on the semiconductor base material that is exposed below the insulating layer, the first semiconductor layer having an opening that exposes the semiconductor base material; an opening plane exposing a side face of the first semiconductor layer and provided below the support film, the second semiconductor layer and the first semiconductor layer by using the mask pattern as a mask; a portion defining a hollow part between the second semiconductor layer and the semiconductor base material; a first insulating film formed in the hollow part; and a second insulating film formed above the semiconductor base material on which the first insulating film is formed. The SOI forming region is provided in a plural number, and the insulating layer has a planar shape that encloses the SOI forming regions and separates one of the SOI forming regions from other SOI forming region in the enclosed area.
