Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 28, 2009
Patent Application Number
11060495
Date Filed
February 18, 2005
Patent Primary Examiner
Patent abstract
A semiconductor package is provided with a low thermal conductivity plate that covers an entire upper surface of a heat dissipating component, by which heat dissipation from the heat dissipating component can be inhibited during a reflow process. Accordingly, sufficient heat can be transmitted to solder balls, so as to heat the solder balls up to a desired temperature. As a result, the semiconductor package and a substrate can be fully bonded via the solder balls, and thereby an excellent mounting performance is achieved.
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