Patent attributes
IPG connector headers for implantable medical devices are provided. In one embodiment of the invention, an IPG connector header having a header bore for receiving and making electrical connection to a lead connector assembly of an implantable medical device comprises a non-conductive header base and a plurality of electrically conductive header connector elements disposed within the header base. A plurality of electrically insulative fluid seals are interposed between the header connector elements. Each fluid seal has a fluid seal bore and is formed from an elastomeric material and an additive. The additive is formulated to reduce the frictional forces required to insert the lead connector assembly through the fluid seal bores of the fluid seals.
