US Patent 7527827 Substrate processing apparatus and substrate processing method

A method for performing a predetermined process on a substrate having coating film formed thereon includes preparing a data base denoting a relationship between each of parameters and a processing time of a predetermined process and storing the data base in a control section. The parameters include the temperature of a disposing plate, a supply rate of an ammonia gas, and an amount of a water vapor contained in the ammonia gas. The method further includes inputting a preset specific time value of the process into the control section; calculating candidate values of the parameters to finish the predetermined process by the specific time value; and determining specific values of the parameters to be used, based on the candidate values.