Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ravichandra V. Palaparthi0
Bo Jiang0
Gregory P. Muldowney0
Date of Patent
May 12, 2009
0Patent Application Number
118398740
Date Filed
August 16, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
