Patent 7531244 was granted and assigned to DSM (company) on May, 2009 by the United States Patent and Trademark Office.
The invention relates to plywood, comprising at least two wood veneer layers and at least one adhesive layer, whereby the adhesive layer comprises a resin composition comprising a triazine compound (T), formaldehyde (F) and optionally urea, wherein the molar F/(NH2)2 ratio of the adhesive layer lies between 0.70 and 1.10 and the molar F/T ratio of the adhesive layer lies between 1.0 and 3.5. The invention further relates to a process for the preparation of plywood.