US Patent 7531893 Power semiconductor devices having integrated inductor
Patent 7531893 was granted and assigned to Texas Instruments on May, 2009 by the United States Patent and Trademark Office.
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Patent abstract
An electronic device (100) with one or more semiconductor chips (102) has an inductor (101) assembled on or under the chips. The inductor includes a ferromagnetic body (111) and a wire (104) wrapped around the body to form at least a portion of a loop; the wire ends (104a) are connected to the chips. The assembly is attached to a substrate (103), which may be a leadframe. The device may be encapsulated in molding compound (140) so that the inductor can double as a heat spreader (111c), enhancing the thermal device characteristics.
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US Patent 07531893 Power semiconductor devices having integrated inductor US Patent 7531893 Power semiconductor devices having integrated inductor
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Patent Number
0753189300
Patent Number
753189300
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
075318930
Date of Patent
May 12, 2009
0Patent Application Number
114584170
Date Filed
July 19, 2006
0Official Website
Patent Primary Examiner
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075318930
Date of Patent
May 12, 2009
0Patent Application Number
114584170
Date Filed
July 19, 2006
0Official Website
Patent Primary Examiner
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US Patent 07531893 Power semiconductor devices having integrated inductor
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07531893
Date of patent
May 12, 2009
Patent application number
11458417
Date Filed
July 19, 2006
Patent primary examiner
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