US Patent 7531899 Ball grid array package

Patent 7531899 was granted and assigned to Agilent Technologies on May, 2009 by the United States Patent and Trademark Office.

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Patent

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Current Assignee

Agilent Technologies

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7531899

Date of Patent

May 12, 2009

Patent Application Number

11405337

Date Filed

April 17, 2006

Patent Primary Examiner

‌

Zandra Smith

Patent abstract

An apparatus and method includes an integrated circuit disposed in a ball grid array (“BGA”) package having interconnects on at least one corner without signal assignments.

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