Patent attributes
An active matrix substrate including a substrate, a pixel array, and a peripheral circuit is provided. The substrate has a display region and a peripheral circuit region adjacent thereto. The pixel array is disposed in the display region. The peripheral circuit is disposed in the peripheral circuit region and includes a first signal line, a second signal line, a first bypass-line, a second bypass-line, a plurality of chip bonding pads, a first dummy bonding pad and a plurality of second dummy bonding pads. The first bypass-line and the first signal line transmit the same signal. The second bypass-line and the second signal line transmit the same signal. The chip bonding pads are disposed between the bypass-lines and the pixel array, and are connected to the pixel array. The first dummy bonding pad is connected to the first bypass-line. Each second dummy bonding pad is connected to the second bypass-line.
