Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Thomas J. Brunschwiler0
Urs Kloter0
Bruno Michel0
Hugo E. Rothuizen0
Ryan J. Linderman0
Date of Patent
May 12, 2009
0Patent Application Number
113940070
Date Filed
March 30, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.
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