Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 19, 2009
Patent Application Number
11986803
Date Filed
November 26, 2007
Patent Primary Examiner
Patent abstract
A conduct (3) includes a retention portion (31), a contacting portion (334) extending upwardly from the retention portion (3), a tail portion (34) formed on a distal end of the retention portion. The tail portion (34) has a relatively larger bottom surface vertical to the major surface of the base defining a multilateral-shaped recess (340) adapted to engage a solder member, e.g. solder ball, thereby establishing electrical engagement between the contact and the PCB.
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