Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 19, 2009
Patent Application Number
11707920
Date Filed
February 20, 2007
Patent Primary Examiner
Patent abstract
A method for circuit inspection comprises steps of providing a substrate having a conductive line; and forming a metal layer on at least the conductive layer to increase a contrast between the conductive layer and adjacent area for the circuit inspection. The method further comprising removing the metal layer. The metal layer is removed by a mixture of nitric acid, hydrogen peroxide and fluoride boric acid. The metal includes Silver, Nickel or Tin. The deposit metal can be removed by inter diffusion and form intermetallic compounds (for example Cu6Sn5) into the under laying conducting line.
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