Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 19, 2009
Patent Application Number
11478201
Date Filed
June 29, 2006
Patent Primary Examiner
Patent abstract
An integrated circuit (IC) chip, semiconductor wafer with IC chips in a number of die locations and a method of making the IC chips on the wafer. The IC chips have plated chip interconnect pads. Each plated pad includes a noble metal plated layer electroplated to a platable metal layer. The platable metal layer may be copper and the noble metal plated layer may be of gold, platinum, palladium, rhodium, ruthenium, osmium, iridium or indium.
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