Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tomoki Kato0
Date of Patent
May 19, 2009
0Patent Application Number
117025500
Date Filed
February 6, 2007
0Patent Primary Examiner
Patent abstract
A semiconductor chip and a wiring strip are placed on a flat side of a base sheet. The semiconductor chip has parallel first and second surfaces. Electrodes are connected to the first surface. The electrodes all terminate in the plane of the flat side of the base sheet and adhesively connected to the flat side of the base sheet. The wiring strip has one end portion connected to the second surface of the semiconductor chip and the opposite end portion terminating in the plane of the flat side of the base sheet and adhesively connected to the flat side of the base sheet. A mold resin fills gaps between the semiconductor chip, the wiring strip, and the base sheet to lock the semiconductor chip and the wiring strip. The base sheet is removed.
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