Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 19, 2009
Patent Application Number
11764860
Date Filed
June 19, 2007
Patent Primary Examiner
Patent abstract
A method for bonding a semiconductor chip is disclosed. In accordance with the method of the present invention, a front surface of a wafer is mounted in a wafer holder to face downward. Each of dies of the wafer is then pushed downward to a tray disposed therebelow, thereby eliminating a need for a separate flipping process of the semiconductor chip and two or more robot arms.
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