A slider having bonding pads opposite an air bearing surface and a method for producing the same is disclosed. Bonding pads are formed on the side of a slider assembly opposite the air bearing surface (ABS) to allow electrical probing devices on the slider while applying pressure to the slider during the lapping process and to allow a flip chip bonding process of the slider to the suspension thereby reducing or eliminating the need to bend wires and attach to the end of the slider body.