US Patent 7538440 Method for improved high current component interconnections
Patent 7538440 was granted and assigned to Intel on May, 2009 by the United States Patent and Trademark Office.
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Patent abstract
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
75384400
Date of Patent
May 26, 2009
0Patent Application Number
104276810
Date Filed
April 30, 2003
0Patent Primary Examiner
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US Patent 07538440 Method for improved high current component interconnections US Patent 7538440 Method for improved high current component interconnections
Infobox
Patent Number
0753844000
Patent Number
753844000
Edits on 19 May, 2023
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Official Website
Edits on 21 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075384400
Date of Patent
May 26, 2009
0Patent Application Number
104276810
Date Filed
April 30, 2003
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075384400
Date of Patent
May 26, 2009
0Patent Application Number
104276810
Date Filed
April 30, 2003
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
Golden AI
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Infobox (+1 properties)
Infobox
Website URL
Edits on 2 Dec, 2021
Golden AI
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US Patent 07538440 Method for improved high current component interconnections
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07538440
Date of patent
May 26, 2009
Patent application number
10427681
Date Filed
April 30, 2003
Patent primary examiner
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