Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 2, 2009
Patent Application Number
11308598
Date Filed
April 10, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A thermal module includes a heat spreader (50) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink (60), a heat pipe (70) thermally connecting the heat spreader and the heat sink. A frame (80) is detachably mounted on the heat spreader, for fixing the heat spreader to the printed circuit board so that the heat spreader can thermally contact with the heat-generating device on the printed circuit board. The heat spreader has a simple polygonal configuration. The frame is formed by stamping a metal sheet or plastics injection molding.
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