Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 9, 2009
Patent Application Number
11481696
Date Filed
July 5, 2006
Patent Primary Examiner
Patent abstract
The invention relates to a method of fabricating a release substrate produced from semiconductor materials, the method comprising creating a reversible connection between two substrate release layers characterized in that the reversible connection is formed by a connecting layer produced using a first material as the basis, the connecting layer further comprising a nanoparticle concentrating zone of a second material disposed to facilitate release of the substrate, the first and second materials being selected to maintain the bonding energy of the reversible connection substantially constant even when the substrate is exposed to heat treatment.
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