A metal polishing liquid which contains a compound represented by the following formula (1), an aromatic heterocyclic ring compound, and an oxidizing agent, and a chemical mechanical polishing method using the metal polishing liquid. In the formula (1), R1 denotes an alkylene group, and R2 and R3 each separately denote a hydrogen atom, a halogen atom, an acyl group, an alkyl group, an alkenyl group, an alkynyl group, or an aryl group.