US Patent 7544540 Encapsulated electrical component and production method
Patent 7544540 was granted and assigned to Epcos Ag on June, 2009 by the United States Patent and Trademark Office.
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Patent Inventor Names
Alois Stelzl0
Christian Bauer0
Hans Krueger0
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Patent abstract
A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.
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US Patent 07544540 Encapsulated electrical component and production method US Patent 7544540 Encapsulated electrical component and production method
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Patent Number
07544540
Patent Number
7544540
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US Patent 07544540 Encapsulated electrical component and production method
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Is a
Current assignee
Patent jurisdiction
Patent number
07544540
Date of patent
June 9, 2009
Patent application number
11578854
Date Filed
April 21, 2005
Patent primary examiner
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