Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yosuke Watanabe0
Nobumori Ogoshi0
Taizo Kise0
Tatsuya Inaoka0
Keiji Nomaru0
Kohei Matsumoto0
Koichi Mitani0
Masaru Nakamura0
Date of Patent
June 9, 2009
0Patent Application Number
116505030
Date Filed
January 8, 2007
0Patent Primary Examiner
Patent abstract
A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.
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