Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 16, 2009
Patent Application Number
11598647
Date Filed
November 14, 2006
Patent Primary Examiner
Patent abstract
A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical connections being formed between respective pairs of conductors of the subassemblies in such a manner that the metallurgies of the conductors, and those of an interim metallic solder paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies is forced to flow to engage and surround the conductor coupling, without adversely affecting the electrical connection formed.
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