Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Norman Glyn Connah0
Mark Pavier0
Date of Patent
June 16, 2009
0Patent Application Number
114104570
Date Filed
April 24, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device package includes a die pad, a substrate disposed on the die pad, and a III-nitride based semiconductor device disposed on the substrate. The device package may also include a second semiconductor device disposed on the die pad or the substrate, which device may be electrically connected to the III-nitride based device to form a circuit.
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