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US Patent 7550097 Thermal conductive material utilizing electrically conductive nanoparticles
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Patent
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Date Filed
September 3, 2003
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Date of Patent
June 23, 2009
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Patent Application Number
10654391
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Patent Citations Received
US Patent 11955438 Thermally-conductive electromagnetic interference (EMI) absorbers
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US Patent 11678470 Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide
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US Patent 11773254 Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods
Patent Inventor Names
Raymond Albert Fillion
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Davide Louis Simone
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Hong Zhong
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Sandeep Shrikant Tonapi
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
7550097
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Patent Primary Examiner
Mark Kopec
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