US Patent 7550825 Interlayer dielectric and pre-applied die attach adhesive materials
Patent 7550825 was granted and assigned to Henkel Corporation on June, 2009 by the United States Patent and Trademark Office.
Is a
Date Filed
June 5, 2007
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Date of Patent
June 23, 2009
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Patent Application Number
11758089
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Patent Inventor Names
James T. Huneke
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Qing Ji
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Puwei Liu
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Benedicto delos Santos
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Kang Yang
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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