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US Patent 7550857 Stacked redistribution layer (RDL) die assembly package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
November 16, 2006
Date of Patent
June 23, 2009
Patent Application Number
11560496
Patent Citations Received
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US Patent 12080684 Die stacks and methods forming same
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US Patent 11700692 Stackable via package and method
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US Patent 11756931 Chip package structure with molding layer
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US Patent 11855023 Wafer level fan out semiconductor device and manufacturing method thereof
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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof
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US Patent 12009343 Stackable package and method
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Patent Inventor Names
Joseph Marco Longo
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Christopher M. Scanlan
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7550857
Patent Primary Examiner
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Nitin Parekh

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