US Patent 7551441 Heat dissipation assembly for computing devices
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Patent Inventor Names
Alan Mark Cohen0
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Patent abstract
An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.
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US Patent 07551441 Heat dissipation assembly for computing devices US Patent 7551441 Heat dissipation assembly for computing devices
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Patent Number
075514410
Patent Number
75514410
Edits on 23 Sep, 2022
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Patent Jurisdiction
Patent Number
075514410
Date of Patent
June 23, 2009
0Patent Application Number
119471820
Date Filed
November 29, 2007
0Official Website
Patent Primary Examiner
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US Patent 07551441 Heat dissipation assembly for computing devices
Infobox
Is a
Patent jurisdiction
Patent number
07551441
Date of patent
June 23, 2009
Patent application number
11947182
Date Filed
November 29, 2007
Patent primary examiner
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