Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 30, 2009
Patent Application Number
11388828
Date Filed
March 24, 2006
Patent Primary Examiner
Patent abstract
An embodiment of the present invention is a technique to form stress sensors on a package in situ. A first array of carbon nanotubes (CNTs) aligned in a first orientation is deposited at a first location on a substrate or a die in a wafer. The first array is intercalated with polymer. The first polymer-intercalated array is covered with a protective layer. A second array of CNTs aligned in a second orientation is deposited at a second location on the substrate or the die. The second array is intercalated with polymer.
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