Patent 7553704 was granted and assigned to Freescale Semiconductor on June, 2009 by the United States Patent and Trademark Office.
An antifuse element (102, 152, 252, 302, 352, 402, 602, 652, 702) and method of fabricating the antifuse element, including a substrate material (101) having an active area (106) formed in an upper surface, a gate electrode (104) having at least a portion positioned above the active area (106), and a gate oxide layer (110) disposed between the gate electrode (104) and the active area (106). The gate oxide layer (110) including the fabrication of one of a gate oxide dip (128) or a gate oxide undercut (614). During operation a voltage applied between the gate electrode (104) and the active area (106) creates a current path through the gate oxide layer (110) and a rupture of the gate oxide layer (110) in a rupture region (130). The rupture region (130) defined by the oxide structure and the gate oxide dip (128) or the gate oxide undercut (614).