US Patent 7554323 Direct facility water test head cooling architecture

An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a first base to receive and removably mount the instrument within the air chamber, a test head inlet in fluid communication with the first base and a facility water supply, a test head discharge in fluid communication with the first base and a facility drain, and a fan in fluid communication with the air chamber inlet to induce the flow of air from the air chamber inlet to the air chamber outlet.