Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 7, 2009
Patent Application Number
11145542
Date Filed
June 2, 2005
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.