Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 7, 2009
Patent Application Number
11709337
Date Filed
February 21, 2007
Patent Primary Examiner
Patent abstract
The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces the carrier and a first cavity is formed between the two semiconductor chips.
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