US Patent 7558062 Heat-dissipating module and electronic apparatus
Patent 7558062 was granted and assigned to Inventec on July, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 5, 2007
Date of Patent
July 7, 2009
Patent Application Number
11850500
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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