Patent attributes
An electronic element module and an electronic device using the same are provided. The electronic element module includes a circuit board and a plurality of electronic elements. In one embodiment, the circuit board has a plurality of leg-holes. Each of the electronic elements includes a body and a plurality of legs that connected to the body. Wherein, the bodies of the electronic elements are glued each other, and the legs of the electronic elements are partially plugged in the leg-holes. In another one embodiment, the circuit board has a plurality of contacts. The electronic element is disposed on the circuit board with a gap therebetween. The electronic element has a plurality of terminals that electrically connect to the contacts of the circuit board correspondingly. Otherwise, the gap is filled with glue.
