A socket connector assembly for holding a semiconductor package comprises a socket connector and an actuator assembled to the socket connector. The actuator comprises a housing defining an opening on a bottom face thereof; a cam portion retained to the housing and being able to rotate; and a floating module. The floating module is movably mounted to the housing and defines a topmost position and a lowermost position relative to the housing. The floating moves between the topmost position and the lowermost position during a rotation of the cam portion. The floating module has an engaging portion to contact with the semiconductor package when the floating module is at the lowermost position.