Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 28, 2009
Patent Application Number
12140041
Date Filed
June 16, 2008
Patent Primary Examiner
Patent abstract
A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa).(1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less.(2) D23≧5(3) D150≧2.5(4) (D−65/D150)≦3.0(5) H23≧140(6) (H−65/H150)≦2.3.
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