Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 4, 2009
Patent Application Number
11307619
Date Filed
February 15, 2006
Patent Primary Examiner
Patent abstract
A thermal module (10) for dissipating heat from a heat-generating electronic component (20) includes a base plate (11), a heat-dissipating fan (16) mounted to one side of the base plate, at least a heat pipe (12) mounted to another side opposite to the one side of the base plate, and a fin assembly (14) mounted to an air outlet of the heat-dissipating fan. The heat pipe includes a bending portion (124). The fin assembly includes a portion (142) corresponding to the bending portion of the heat pipe. The fins of the portion of the fin assembly are arranged along an extension direction of the bending portion of the heat pipe.
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