US Patent 7569918 Semiconductor package-on-package system including integrated passive components

Patent 7569918 was granted and assigned to Texas Instruments on August, 2009 by the United States Patent and Trademark Office.

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Patent Citations Received

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US Patent 11894322 Launch structures for radio frequency integrated device packages

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Patent Inventor Names

Abram M. Castro0

Kurt P. Wachtler0

Mark A. Gerber0

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Patent abstract

A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=075699180

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edited on 21 May, 2023