Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sang-Ho Lee0
Date of Patent
August 4, 2009
0Patent Application Number
113269250
Date Filed
January 6, 2006
0Patent Primary Examiner
Patent abstract
A multi-chip package is provided. The multi-chip package includes semiconductor chips. The multi-chip package receives selection signals for selecting two or more chips in response to the selection signals. Any number of chips may be simultaneously selected for a test and the test time can be reduced.
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