Patent attributes
A solderless, direct cable interconnect for an array transducer and method for the fabrication thereof. An ultrasonic array transducer includes an acoustic backing layer, a piezoelectric layer containing an array of piezoelectric elements (typically created from a solid layer of piezoelectric material disposed over a matching layer cut with a dicing saw and fixed on a solid ground plane), and plurality of control wires, disposed between the backing layer and the piezoelectric layer. A solid backing material which will displace slightly at temperature and pressure is formed into the desired shape. Kerfs are precisely cut into the shaped backing material in a pattern such that they will line up with the center of each piezoelectric element in the piezoelectric layer. Signal wires are disposed across the backing material along the kerfs, and the piezoelectric layer is aligned and then compression bonded to the backing layer, encapsulating the signal wires and electrically connecting them to the piezoelectric elements without the need for an intermediate connection board or flex circuit.
