US Patent 7572168 Method and apparatus for high speed singulation

A method of singulating semiconductor devices applies a blade to a molded strip that includes the semiconductor device. The blade generates a kerf at a contact point between the blade and the molded strip. The kerf is filled with a plurality of particles. The kerf separates the semiconductor device from the molded strip. The method cools the blade by using a synthetic lubricant. The method lubricates the blade by using the synthetic lubricant. The method rinses the kerf by using the synthetic lubricant. Rinsing the kerf removes a substantial quantity of the particles from the kerf. A system singulates semiconductor devices from a molded strip by using a blade, a temperature control device, and a synthetic lubricant. The blade singulates the semiconductor device from the molded strip. The temperature control device applies the synthetic lubricant to the blade. The synthetic lubricant cools, lubricates, or rinses the blade, or a combination thereof, during a singulation process.