Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 11, 2009
Patent Application Number
11309027
Date Filed
June 12, 2006
Patent Primary Examiner
Patent abstract
A printed circuit board includes a plurality of pairs of first bond pads mounted on an area of a surface thereof, and a plurality of pairs of second bond pads mounted to on the same area thereof. One first bond pad of each pair is electrically connected to a first signal wire. The other first bond pad of each pair is electrically connected to a second signal wire. One second bond pad of each pair is connected to a first bond pad of one pair that are connected with the first signal wire. The other second bond pad of each pair is connected to a first bond pad of another pair that is connected with the second signal wire.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
